Generally, the combination of microchips, electricity and fluids is usually considered an incredibly bad thing. IBM, however, thinks it can combine those three to make super small and super powerful computers in the future. The idea is to stack hundreds of silicon wafers and utilize dual fluidic networks between them to create 3D processors. In such a setup, one network carries in charged fluid to power the chip, while the second carries away the same fluid after it has picked up heat from the active transistors. Of course, 3D chips are already on the way, and liquid cooled components are nothing new, but powering a PC by fluids instead of wires has never been done before.